Polyamide resin, which has been widely used as a curing agent for epoxy resin, is formed by the condensation reaction between dimer acid and polyamine, and contains reactive primary and secondary amines in its molecules.
Polyamide resins are durable and have excellent friction/abrasion resistance and oil/solvent resistance. For these favorable characteristics, polyamide resins are widely utilized for industrial materials.
Polyamide resins find wide use as binders in printing inks for flexogravure application on certain paper, film, and foil webs.
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